Laser Direct Imaging
TZTEK TZDI series laser direct imaging equipment adopts sub-micron precision drive control platform, a new generation of DMD control technology and optical imaging design, and integrates TZTEK vision algorithm, integrating calibration, compensation algorithm and other technologies to ensure higher imaging quality, capacity and registration accuracy. Suitable for image transfer of double-sided, multi-layer, HDI boards in the field of rigid boards, as well as FPC and IC substrates.
| Model | TZDI-6 | TZDI-12 | TZDI-20 | TZDI-25 | TZDI-35 |
| Substrate size | 630×660 mm | 630×810 mm | 550×810 mm | 530×850 mm | 630×810 mm |
| Substrate thickness | 0.025-5.0 mm | 0.02-5.0 mm | 0.05-5.0 mm | 0.05-5.0 mm | 0.05-5.0 mm |
| Limit | 6 μm | 12 μm | 20 μm | 25 μm | 35 μm |
| MP analysis | 12 μm | 20 μm | 35 μm | 40 μm | 50 μm |
| Line width accuracy | ±10% | ±10% | ±10% | ±10% | ±10% |
| Alignment accuracy | ±6μm | ±8μm | ±8μm | ±12μm | ±12μm |
| Lnter Layer alignment accuracy | 10 μm | 16 μm | 24 μm | 24 μm | 24 μm |
| Maximum capacity | 20mj / s @30 | 20mj / s @14 | 20mj / s @8 | 20mj / s @8 | 20mj / s @8.5 |
| Recommended application | IC substrate | IC substrate,SLP | HDI,MLB,FPC | PCB, FPC | MLB (inner and outer layer) ceramic substrate |
| Model | TZUVDI-20 | TZUVDI-35 |
| Substrate size | 600×660 mm | 609×810 mm |
| （550×610 mm, 630×810 mm） | ||
| Substrate thickness | 0.05-5.0 mm | 0.05-5.0 mm |
| Minimum window | 50 μm | 100 μm |
| Minimum resistance welding bridge | 50 μm | 75 μm |
| Line width accuracy | ±10% | ±10% |
| Alignment accuracy | ±12μm | ±12μm |
| Lnter layer alignment accuracy | 24 μm | 24 μm |
| Maximum capacity | 50seconds / face @ 300MJ | 12 seconds / face @ 300MJ |
| Recommended application | Soft board and hard board anti welding, inner and outer circuit | Soft board and hard board anti welding, inner and outer circuit |
| Other | / | 415nm light source is selected for white oil application |
| Model | TZDI-25R |
| Substrate size | 250×2400 · 520×2400 mm |
| Substrate thickness | 0.02-0.25 mm |
| Limit | 25 μm |
| MP analysis | 40 μm |
| Line width accuracy | ±10% |
| Alignment accuracy | ±30@260×1200μm |
| Maximum capacity | 3m/min@20mj/cm2 |
| Recommended application | FPC |
| Model | TZLUVDI-35 | ||||
| Substrate size | 630×810 mm | ||||
| Substrate thickness | 0.05-5.0 mm | ||||
| Minimum window | 100 μm | ||||
| Minimum resistance relding bridge | 75 μm | ||||
| Line width accuracy | ±10% | ||||
| Alignment accuracy | ±12μm | ||||
| Lnter Layer alignment accuracy | 24 μm | ||||
| Maximum capacity | 10.5s /face @ 500mj/cm2 15s / face @ 1000mj/cm2 | ||||
| Recommended application | Soft board and hard board anti welding, inner and outer circuit | ||||
